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Packaging Eng (Materials)
Intel | Santa Clara, California
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Job Description

Packaging Eng (Materials)—Emphasis in working with the material suppliers and materials technology group to establish a package materials property requirement, establish materials specs, capture
IPs, and deploy/develop advanced package analytical laboratory tools and techniques and technical application with training notes to world-wide packaging community. Design and develop product packaging and provide ongoing engineering support for integrated circuit or semiconductor assemblies.
Requires BS+5 yrs exp OR MS+3 yrs exp (#3501); or MS+3 yrs exp (#3502).

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