Experience:
No experience
Employment Type:
Intern/Co-op
Posted:
3/6/2019
Job Category:
Engineering
See more jobs for students and recent grads who studied:
Electrical Engineering Intern-Facilities Infrastructure
Hewlett-Packard (HP) | Corvallis, Oregon
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Job Description

At HP, talent is our criteria. Join us in reinventing the standard for diversity and inclusion. Bring your awesomeness, and just be you!

Applies basic foundation of a function's principles, theories and concepts to assignments of limited scope. Uses professional concepts and theoretical knowledge acquired through specialized training, education or previous experience. Develops expertise and practical knowledge of applications within business environment. Acts as team member by providing information, analysis and recommendations in support of team efforts. Exercises independent judgment within defined parameters.

Responsibilities:

* Participate as a member of the facilities infrastructure engineering team with other systems engineers, systems designers, project managers, and internal and outsourced partners to develop and execute reliable, cost effective and high quality facilities infrastructure solutions that support development and manufacturing operations.
* Managing system support for continued operation of manufacturing systems.
* Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.
* Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
* Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development.
* Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.

Education and Experience Required:

Four-year university student currently pursuing a degree with a focus on facilities/infrastructure electrical engineering. Must have completed the 3rd year of engineering studies prior to beginning the internship.

Knowledge and Skills:

* Good analytical and problem solving skills.
* Understanding of thermal properties of materials and heat transfer.
* Good written and verbal communication skills; mastery in English and local language.

About Hewlett-Packard (HP)

Hewlett-Packard Company is a provider of products, technologies, software, solutions and services to individual consumers, small- and medium-sized businesses (SMBs) and large enterprises, including the public and education sectors. Its offerings span personal computing and other access devices; imaging and printing-related products and services; enterprise information technology infrastructure, including enterprise storage and server technology and software that optimizes business technology investments, and multi-vendor customer services, including technology support and maintenance, consulting and integration and outsourcing services, as well as application services and business process outsourcing. During the fiscal year ended October 31, 2008, its operations were organized into seven business segments: Enterprise Storage and Servers, HP Services, HP Software, the Personal Systems Group, the Imaging and Printing Group, HP Financial Services and Corporate Investments.

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