Experience:
No experience
Employment Type:
Intern/Co-op
Posted:
9/8/2019
Job Category:
Other
Intern
Benchmark Electronics | Tempe, Arizona
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Job Description

Job Description

Job Title

Intern

Job ID(Requisition ID):

4451

Job Summary

Manufacturing Engineering Internship beginning Fall 2019 and continuing through Spring 2020. This is an opportunity to work with Benchmark Precision Technologies, a division of Benchmark Electronics and explore the world of CNC Machining and Manufacturing.

Essential Functions and Competencies

N/A

Qualifications / Education / Experience

An intern within Manufacturing Engineering may be working on projects related to the following:

* Work fluidly in a highly cross-functional team environment involving manufacturing and product development teams, as well as supply chain specialists, quality assurance, manufacturing engineers, and logistics personnel.
* Support control plans to assure critical features are controlled through the assembly/production process.
* Support Lean manufacturing and 5S initiatives.
*

About Benchmark Electronics

We are a world-leading, top-10 EMS provider of integrated electronic manufacturing services with total revenues exceeding $2.5B and with employees in 10 countries on 3 continents offering everything from product development to regional PCB build – including system level assembly in the United States, Mexico, South America, Europe and Asia. We provide service to original equipment manufacturers (OEMs) of computers and manufacturing services from initial product design to volume production including direct order fulfillment and post-deployment services. Products we engineer live inside some of the world’s fastest computers. 

Our precision technology manufacturing capabilities complement our proven electronic manufacturing expertise by providing further vertical integration of critical mechanical components. These capabilities include precision machining, advanced metal joining, assembly and functional testing for multiple industries including medical, instrumentation, and semiconductor capital equipment.  We believe that we have developed strengths in the manufacturing process for large, complex, highdensity printed circuit boards as well as the ability to manufacture high and low volume products in regions such as China, Malaysia, Mexico, Romania and Thailand.

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